Open tender · India · Services
Processing of Epi-Wafer and Fabrication of 976nm Laser Chips and Packaging
Department of Defence Research and Development · SSPL, DELHI
Department of Defence Research and Development in India is inviting bids for “Processing of Epi-Wafer and Fabrication of 976nm Laser Chips and Packaging”. Bids close on 15 October 2026; bid security (EMD) is ₹2.97 lakh. Reference: SSPL/MMG/DPP/SBM/B/R/26-27/094.
Key facts
- Bid security (EMD)
- ₹2.97 lakh
- Tender type
- Single
- Published
- 01 Oct 2026
- Reference
- SSPL/MMG/DPP/SBM/B/R/26-27/094