Open tender · India · Services

Processing of Epi-Wafer and Fabrication of 976nm Laser Chips and Packaging

Department of Defence Research and Development · SSPL, DELHI

Department of Defence Research and Development in India is inviting bids for “Processing of Epi-Wafer and Fabrication of 976nm Laser Chips and Packaging”. Bids close on 15 October 2026; bid security (EMD) is ₹2.97 lakh. Reference: SSPL/MMG/DPP/SBM/B/R/26-27/094.

Key facts

Bid security (EMD)
₹2.97 lakh
Tender type
Single
Published
01 Oct 2026
Reference
SSPL/MMG/DPP/SBM/B/R/26-27/094